Low Dielectric Materials Market – Trends Forecast Till 2030

Market Snapshot

Market Overview

The global Low Dielectric Materials Market size is projected to reach a CAGR of 6.7% from 2023-2030.

A dielectric material is a poor conductor of electricity but an efficient supporter of electrostatic fields. It can store electrical charges and have a high specific resistance and a negative temperature coefficient of resistance. Low-κ dielectric materials are those that have a low dielectric coefficient and are less likely to break down when subjected to higher electric fields. This leads to low dielectric materials also known as low-k materials being utilized to continue scaling microelectronic devices, colloquially referred to as extending Moore's law. As components have scaled and transistors have gotten closer together, the insulating dielectrics have thinned to the point where charge build-up and crosstalk adversely affect the performance of the device. Replacing the silicon dioxide with a low-κ dielectric of the same thickness reduces parasitic capacitance, enabling faster switching speeds (in the case of synchronous circuits) and lower heat dissipation.

The various factors propelling the growth of the market are the Development of 5G Communication, the Increase in Delivery of Airplanes and Automobile Production, the Increasing Use of Engineering Resin Substitutes for Ultra-Thin Components, and the Use of Low-Dielectric-Constant Materials for High-Speed Communication Networks.

On the other hand, High Processing and Manufacturing Costs are restraining the growth of the market globally. Additionally, factors like Challenges in Processing Low Dielectric Resin and Intense Price Competition from Chinese Manufacturers will create challenges for the market in the coming years.

Delvens Industry Expert's Standpoint

The automobile industry's sustained growth has paved the way for breakthroughs in in-car infotainment and autonomous vehicles, which has significantly increased the demand for packaging materials with higher levels of dependability. Independent car manufacturers require packaging materials with a low dielectric constant to meet the demands for quick responses, high speeds, and minimal delays. Meanwhile, the trend towards commercial aircraft electrification has been on the rise in recent years, which involves replacing hydraulic, mechanical, and pneumatic systems with electrical systems. As a result, the aerospace and automobile industries require more low-dielectric materials, which are expected to contribute to the growth of the global market. The demand for low-dielectric materials is expected to continue to rise as technological advancements in both the automotive and aerospace industries progress.

Market Portfolio

Key Findings

• The type segmented is further segmented into Thermoplastic, Thermoset and Ceramics. The thermoset segment is growing at a higher CAGR and is anticipated to dominate the market. The demand for thermosets is increasing considerably, mainly due to its ability to easily form a stable shape with excellent resistance to deformation during heat application. These resins also offer considerable strength, toughness, and electrical resistance, making them especially suitable for the manufacturing of printed wiring boards.
   
• The material type segment is further segmented into Modified Polyphenylene Ether, Polyimide, Cyclic Olefin Copolymer, Cyanate Ester, Liquid Crystal Polymer, Others (Ceramics, BCB, SiLK, SLK, PEEK) and Fluoropolymer. Fluoropolymer segment is anticipated to dominate the market during the forecast period. Fluoropolymers prove to be an excellent material for manufacturing these components due to their low cost, excellent resistance to heat and low dielectric constants thus, are widely used.

• The application segment is further fragmented into PCBs, Antenna, Microelectronics, Wire & Cable, Radome and Others (CMOS Devices, and Sensor Devices. The PCBs are anticipated to dominate the market during the forecast period. Low dielectric materials are used as the interconnecting insulator material between the terminal of PCB, allowing low loss of signal and reduced crosstalk. With the demand for PCBs gaining traction across the globe, the demand for low dielectric materials is expected to increase significantly during the forecast period.
   
• The market is also divided into various regions such as North America, Europe, Asia-Pacific, South America, and Middle East and Africa. APAC is the most significant and fastest-growing low dielectric materials market due to the increasing demand for these materials in manufacturing electronic components such as PCBs and microelectronics.

Regional Analysis

Asia Pacific to Dominate the Market

• APAC is the most significant and fastest-growing low dielectric materials market due to the increasing demand for these materials in manufacturing electronic components such as PCBs and microelectronics.
   
• Furthermore, the increase in air traffic have expanded the demand for antenna and radomes in the region, further driving the demand for low dielectric materials to newer heights.

Competitive Landscape