The global 2.5D & 3D Semiconductor Packaging Market size is projected to reach a CAGR of 17.7% from 2023-2030.
2.5D/3D are packing methodologies for including numerous IC inside the same package. In a 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer to achieve significantly high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint.
The growth of the market is attributed to the growing consumption of semiconductor devices across several industries. Additionally, increasing demand for compact, high-functionality electronic devices is also going to drive the market. Furthermore, the growing adoption of high-end computing, servers, and data centers is going to provide the market with new opportunities.
On the other hand, high initial investment and increasing complexity of semiconductor IC designs is the major restraining factor for the market.
A pandemic like COVID-19 is anticipated to fuel the manufacturing of advanced medical devices and equipment to tackle such crises in the future. For instance, in 2021, GE Healthcare announced that it would increase its manufacturing capacity for medical equipment, including CTs, ultrasound devices, mobile X-ray systems, patient monitors, and ventilators, to cater to the ongoing challenge of treating COVID-19 patients. Since 2.5D & 3D Semiconductor Packaging has numerous applications in the medical industry, the proliferation of medical equipment manufacturing is expected to drive market growth.
Regarding the qualities, integration, and energy efficiency of the product, semiconductor packaging has undergone constant change and transformation. Suppliers of semiconductor packaging are creating processes and plan to reduce the total cost of advanced packaging and give the highest operational effectiveness with the semiconductor market growing and expanding. Additionally, the market is continuously undergoing improvements and advancements for improving packaging solutions. The market for smartphones is expanding, wearables and smart devices are becoming more popular, and consumer IoT device penetration is developing in applications like smart homes having a major influence on this market. The 5G smartphones with increased silicon content are also expected to increase in the coming future giving a further boost to the market.
